Jing-Ye Huang: search on Z-Library

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1

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Assembly of 3D chip stack with 30μm-pitch micro interconnects using novel arrayed-particles anisotropic conductive film

Huang, Yu-Wei, Lin, Yu-Min, Zhan, Chau-Jie, Lu, Su-Tsai, Huang, Shin-Yi, Juang, Jing-Ye, Fan, Chia-Wen, Chung, Su-Ching, Peng, Jon-Shiou, Chen, Su-Mei, Lu, Yu-Lan, Chang, Pai-Cheng, Lau, John H.

Year:

2013

Language:

english

File:

PDF, 835 KB

english, 2013

2

A multiplex PCR for differential detection of Echinococcus granulosus sensu stricto, Echinococcus multilocularis and Echinococcus canadensis in China

Shang, Jing-Ye, Zhang, Guang-Jia, Liao, Sha, Huang, Yan, Yu, Wen-Jie, He, Wei, Yang, Guang-You, Li, Tiao-Ying, Chen, Xing-Wang, Zhong, Bo, Wang, Qian, Wang, Qi, Li, Rui-Rui, Wang, Hao

Journal:

Infectious Diseases of Poverty

Year:

2019

Language:

english

File:

PDF, 753 KB

english, 2019

3

Uncertainty analysis for measurement of measurand

Hung-Chia Chen, Pei-Chen Wu, Jing-Ye Huang, Lin-An Chen

Journal:

Year:

2010

Language:

english

File:

PDF, 164 KB

english, 2010

4

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Development of fluxless chip-on-wafer bonding process for 3DIC chip stacking with 30μm pitch lead-free solder micro bumps and reliability characterization

Zhan, Chau-Jie, Juang, Jing-Ye, Lin, Yu-Min, Huang, Yu-Wei, Kao, Kuo-Shu, Yang, Tsung-Fu, Lu, Su-Tsai, Lau, John H., Chen, Tai-Hong, Lo, Robert, Kao, M. J.

Year:

2011

Language:

english

File:

PDF, 4.17 MB

english, 2011

5

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Effect of metal finishing fabricated by electro and Electroless plating process on reliability performance of 30μm-pitch solder micro bump interconnection

Juang, Jing-Ye, Huang, Shin-Yi, Zhan, Chau-Jie, Lin, Yu-Min, Huang, Yu-Wei, Fan, Chia-Wen, Chung, Su-Ching, Chen, Su-Mei, Peng, Jon-Shiou, Lu, Yu-Lan, Chang, Pai-Cheng, Wu, Mei-Lun, Lau, John H.

Year:

2013

Language:

english

File:

PDF, 2.16 MB

english, 2013

6

Calcium overload induces C6 rat glioma cell apoptosis in sonodynamic therapy

Li, Jian-Hua, Yue, Wu, Huang, Zheng, Chen, Zhi-Qiang, Zhan, Qi, Ren, Fu-Bin, Liu, Jing-Ye, Fu, Song-Bin

Journal:

International Journal of Radiation Biology

Year:

2011

Language:

english

File:

PDF, 327 KB

english, 2011

7

[IEEE 2014 International Conference on Electronics Packaging (ICEP) - Toyama, Japan (2014.4.23-2014.4.25)] 2014 International Conference on Electronics Packaging (ICEP) - Effects of bump height and UBM structure on the reliability performance of 60µm-pitch solder micro bump interconections

Yu-Wei Huang,, Chau-Jie Zhan,, Lin Yu-Min,, Jing-Ye Juang,, Shin-Yi Huang,, Su-Mei Chen,, Chia-Wen Fan,, Ren-Shin Cheng,, Shu-Han Chao,, Lin, C. K., Jie-An Lin,, Chen, Chih

Year:

2014

Language:

english

File:

PDF, 2.68 MB

english, 2014

8

Parametric coverage interval

Chen, Lin-An, Huang, Jing-Ye, Chen, Hung-Chia

Journal:

Year:

2007

Language:

english

File:

PDF, 1.04 MB

english, 2007

9

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Effect of joint shape controlled by thermocompression bonding on the reliability performance of 60цm-pitch solder micro bump interconnections

Huang, Yu-Wei, Zhan, Chau-Jie, Juang, Jing-Ye, Yu-Mn, Lin, Huang, Shin-Yi, Chen, Su-Mei, Fan, Chia-Wen, Cheng, Ren-Shin, Chao, Shu-Han, Hsieh, Wan-Lin, Chen, Chih, Lau, John H.

Year:

2014

Language:

english

File:

PDF, 3.81 MB

english, 2014

10

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Development of high throughput adhesive bonding scheme by wafer-level underfill for 3D die-to-interposer stacking with 30µm-pitch micro interconnections

Huang, Yu-Wei, Fan, Chia-Wen, Lin, Yu-Min, Fun, Su-Yu, Chung, Su-Ching, Juang, Jing-Ye, Cheng, Ren-Shin, Huang, Shi-Yi, Chang, Tao-Chih, Zhan, Chau-Jie

Year:

2015

Language:

english

File:

PDF, 7.46 MB

english, 2015

11

miR-601 is a prognostic marker and suppresses cell growth and invasion by targeting PTP4A1 in breast cancer

Hu, Jing-Ye, Yi, Wei, Wei, Xuan, Zhang, Mei-Yin, Xu, Rui, Zeng, Li-Si, Huang, Zhi-Jie, Chen, Jing-Song

Journal:

Biomedicine & Pharmacotherapy

Year:

2016

Language:

english

File:

PDF, 1.95 MB

english, 2016

12

Welsh's Trimmed Mean for the Nonlinear Regression Model

Jing-Ye Huang, Eugene K. Yang, Mei-Ling Lin and Lin-An Chen

Journal:

Year:

2003

Language:

english

File:

PDF, 1.44 MB

english, 2003

13

Seasonal pattern ofEchinococcusre-infection in owned dogs in Tibetan communities of Sichuan, China and its implications for control

Wang, Qian, Yu, Wen-Jie, Zhong, Bo, Shang, Jing-Ye, Huang, Liang, Mastin, Alexander, Renqingpengcuo,, Huang, Yan, Zhang, Guang-Jia, He, Wei, Giraudoux, Patrick, Wu, Wei-Ping, Craig, Philip S.

Journal:

Infectious Diseases of Poverty

Year:

2016

Language:

english

File:

PDF, 757 KB

english, 2016